A controllable semiconductor component having massive heat dissipating conically shaped metal bodies

ABSTRACT

A controllable semiconductor component element has a housing of two massive metal bodies, each of which has a flange which is axially and radially embraced by an insulating ring. A semiconductor element is mounted between the metal bodies and has a cathode side and an anode side carrying a cathode and an anode, respectively which are conductively connected, with respect to heat and current, to the respective metal bodies. The anode is in the form of a ring which circumscribes a control electrode. A lead is connected to the control electrode and extends through an axial opening in the cathode side metal body to the exterior for connection, by way of spring tension, solder or the like to a control lead. The opening is completely filled with an insulating material to center and rigidly fix the lead therein. Each of the metal bodies is conically shaped, tapering away from the semiconductor element, and includes a rounded end to be received in a pressure spring.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a controllable semiconductor component,and more particularly to such a component which has a housing consistingof two massive metal bodies which are surrounded at edge flanges by aninsulation ring, and a semiconductor element mounted between the bodieshaving a cathode on one side and an anode on the other side connected tothe respective bodies in a heat and current conductive relationship, andin which the cathode is ring-shaped and surrounds a control electrode towhich a control lead is attached and extends through the cathode sidemetal body in a fixed and insulated manner.

2. Description of the Prior Art

Semiconductor components of the type generally described above have beenknown for quite some time. The two massive metal bodies in suchsemiconductor components are generally formed by two copper discs whichare connected, for example, by soldering or welding at their edges, by aceramic ring. In these disc-shaped semiconductor components, a lead forthe control electrode is generally extended to the exterior by way ofthe insulating ring. On the exterior of the ring a plug socket isgenerally provided or, for example, a contact is provided in the form ofa leaf spring which can be connected to a feed line. These knowncontacts of the control electrode to a feed line located outside of thehousing are relatively expensive, since they must be accomplishedmanually. In addition, the lead must be installed asymmetrically, thatis in a definite, targeted manner. In addition, great expense isnecessary with regard to the installation, since the lead must not onlybe insulated within the housing, but must also be extended through theinsulation ring in an insulated and gas-tight fashion. This expenseappears tolerable for large thyristors, but is often, for reasons ofcost, intolerable for small components which must be produced andinstalled in large quantities.

SUMMARY OF THE INVENTION

The object of the present invention therefore resides in the provisionof a controllable semiconductor component of the type generallymentioned above, in which a simple contacting of the lead for thecontrol electrode to an exterior feed line is possible.

A feature of the present invention resides in the fact that the cathodeside metal body is provided with a central recess or opening, that thelead is essentially rigidly constructed and is situated in the centralopening, and that the lead projects beyond the cathode side metal bodyto the exterior of the component.

An advantage of the invention is that the position of the lead isindependent of the position at which a certain point on thecircumference of the housing is located. As a result of the fact thatthe lead is essentially rigidly constructed, it is even possible to thencarry out the contacting of the lead by machine, rather than by hand.

Advantageously, the above-mentioned central opening is completely filledwith an insulating material. The mentioned simple contacting can beexpediently carried out by means of a slotted metal clip lying at leastapproximately at right angles to the lead and provided with a notch forreceiving the lead. The lead can, however, also be contacted bysoldering or by a pressure spring.

BRIEF DESCRIPTION OF THE DRAWING

Other objects, features and advantages of the invention, itsorganization, construction and operation will be best understood fromthe following detailed description taken in conjunction with theaccompanying drawing, on which:

FIG. 1 is an elevational view, partially in section, of a controllablesemiconductor component constructed in accordance with the presentinvention;

FIG. 2 illustrates an advantageous embodiment of the exterior contactingof the lead of the component illustrated in FIG. 1;

FIG. 3 illustrates another advantageous embodiment of the exteriorcontacting of the lead of the component illustrated in FIG. 1; and

FIG. 4 illustrates a further advantageous embodiment of the exteriorcontacting of the lead of the component illustrated in FIG. 1.

DESCRIPTION OF THE PREFERRED EMBODIMENT

In FIG. 1, a controllable semiconductor component is generallyillustrated at 1 as comprising an upper massive metal body 2 and a lowermassive metal body 3. Each of the metal bodies 2 and 3 comprises aconductive material, with respect to electrical and heat conduction,which may be, for example, copper. Each of the metal bodies is providedwith a circumferential flange which is embraced, both radially andaxially, this is circumferentially and radially of the entire component,by an insulating ring 4. The insulating ring 4 comprises, for example, asynthetic material which is sprayed on, melted on, shrunk on or cast.Between the metal bodies 2 and 3 is disposed a semiconductor element 5,having a cathode electrode 6 and a control electrode 7. The cathodeelectrode 6 surrounds and is insulated from the control electrode 7. Ananode electrode (not shown) is disposed on the opposite side of thesemiconductor body and is electrically connected to the lower massivemetal body 3.

The upper metal body 2 is provided with a central opening 8 in which alead 10 is centrally situated along the longitudinal axis of thecomponent. The lead 10 rests upon the control electrode 7 and isconnected thereto in a suitable manner, for example by welding,soldering or alloying. The upper metal body 2 rests upon the cathodeelectrode 6 and is connected thereto by suitable means, such as bysoldering, alloying or welding.

Special advantages result from the parts being connected to one anotherby alloying or soldering. In the process, the semiconductor element 5can be alloyed to or soldered onto the lower metal body 3 and, at thesame time, the lead 10 and the upper metal body 2.

The opening 8 is filled with a synthetic insulating material 11, or withglass, which prevents an entry of the outer atmosphere into the interiorof the housing. In addition, the material 11 serves to rigidly fix thelead 10 in position. To that end, the opening 8 is expedientlycompletely filled with synthetic material or glass.

The lead 10 projects above the upper metal body 2 and is contacted thereby a feed line 12. The feed line can, for example, consist of a sheetmetal clip (FIG. 2) which is provided with a cutout 13 into which thelead 10 fits. Further, the clip includes a V-shaped notch 14 so that theclip can be pushed onto the lead 10, whereupon the notch then opens upsufficiently for the lead 10 to slip into the cutout 13. The sheet metalclip then snaps shut to establish a good electrical and mechanicalcontact.

Since the lead 10 is essentially rigidly constructed, other kinds ofconnections to a feed line can also be selected. For example, it ispossible to connect the lead 10 to a feed line 12 by an immersionsoldering process. The lead 10 and the feed line is thus connected by aportion of solder 15 (FIG. 3). The feed line can, for example, be partof a printed circuit or be mounted on a carrier plate. The contact withthe feed line can also be established by a pressure spring 16, whichrests upon the lead 10 (FIG. 4).

The invention is especially advantageously applicable in connection withcontrolled rectifier bridges in which, as is well known in the art, fouror six components each are employed. These can simultaneously beconnected to one carrier which bears four or, respectively, six leads.The invention can find application just as well in connection withsemicontrolled bridges, which, in each case, only half the componentsare embodied as controllable components. The feed-in or, respectively,discharge of the load current of the controllable semiconductorcomponents occurs by way of the metal bodies 2 and 3. These can, asdepicted in the drawing, taper conically away from the semiconductorelement 5 and be installed in correspondingly conically constructedrecesses of bus bars or cooling bodies serving as bus bars. The positionof a point on the circumference of the semiconductor element in relationto a point on the circumference of the opening is unimportant because ofthe rotation symmetry of the semiconductor component.

The metal bodies 2 and 3 can also have a cylindrical form. These bodiescan also have seating portions 9 to be received in springs by which themetal bodies are pressed against the cooling bodies. The seatingportions are preferably constructed in such a manner that as central acontact pressure as possible is guaranteed. In the exemplary embodimentillustrated in FIG. 1, the seating location is constructed with aspherical shape. In case the control electrode and the metal bodies onlyrest on the semiconductor element, without being connected thereto bysoldering or alloying, these springs or a single spring can supply thenecessary inner contact pressure for several component elements.

Although I have described my invention by reference to a particularillustrative embodiment thereof, many changes and modifications of theinvention may become apparent to those skilled in the art withoutdeparting from the spirit and scope of the invention. I therefore intendto include within the patent warranted hereon all such changes andmodifications as may reasonably and properly be included within thescope of my contribution to the art.

I claim:
 1. A controllable semiconductor component for mounting inconically shaped recesses, said component comprising:a semiconductorelement including a ring-shaped cathode on one side, an anode on theopposite side and a control electrode within said ring-shaped cathode; ahousing including a pair of massive metal bodies on respective sides ofsaid semiconductor element connected to said cathode and said anode,respectively, in a heat and electric conductive relationship, said metalbody on said cathode side including a central opening therethrough, andan insulating ring securing and sealing said bodies in the area ofcontact with said semiconductor element, each of said metal bodiescomprising a conical shape tapering in the direction away from saidsemiconductor element for mounting in the conically shaped recesses; anda control lead electrically connected to said control electrode, saidcontrol lead extending through said opening to the exterior of saidhousing and rigidly mounted in an insulated manner within said opening.2. The component of claim 1, comprising:insulating material filling saidopening to rigidly mount said control lead.
 3. The component of claim 1,wherein at least one of said metal bodies comprises a seating portionfor receiving a pressure spring.
 4. The component of claim 1, incombination with a feed line, wherein the distal end of said controllead is soldered to said feed line.
 5. The component of claim 1, incombination with a pressure spring and a feed line connected to saidpressure spring, wherein said control lead is in engagement with saidpressure spring.
 6. The component of claim 1, in combination with a feedline and a metal clip attached to said feed line, said metal clipincluding a notch for receiving said control lead.
 7. The component ofclaim 6, wherein said clip extends at right angles to said control leadsand includes resilient legs extending to said notch to flexibly receivesaid control lead.
 8. A controllable semiconductor component formounting in conically shaped recesses, said component comprising:asemiconductor element including a centrally located control electrode onone side, an anode on the other side, and a cathode spaced from and onthe same side as said control electrode; a pair of conically shapedmetal bodies, one of said bodies connected to said cathode and taperingaway from said semiconductor element, the other of said bodies connectedto said anode and tapering away from said semiconductor element, each ofsaid bodies provided with the conical shape for receipt in the conicalrecesses, said one body having a central opening aligned with saidcontrol electrode, at each of said bodies including a circumferentialflange adjacent the like flange of the other; an insulating ringembracing said flanges to seal and secure said bodies; a control leadextending from the exterior of said component through said opening andcontacting said control electrode; and a vitreous filling in saidopening rigidly securing said control lead and sealing said opening.